Adeia, the company whose patented innovations enhance a number of devices, has announced that Qorvo, a provider of connectivity and power solutions, has licensed Adeia’s hybrid bonding technology.

“Semiconductor industry leaders are looking to 3D structures, packages and interconnect innovations to elevate performance and expand functionality on miniaturised footprints,” said Dana Escobar, chief licensing officer and general manager, semiconductor, for Adeia. “Hybrid bonding technology introduces new opportunities to optimise the architecture of the RF front-end semiconductor devices and modules to enhance functionality, performance and size of the solutions.”

Adeia has pioneered fundamental advances in the semiconductor industry over the last 30 years. With a large and growing portfolio of intellectual property covering hybrid bonding, semiconductor packaging and semiconductor processing technologies, Adeia licenses and partners with leading semiconductor companies around the world to enhance product roadmaps.

Other posts by :

1. Rakuten makes historic satellite video call
2. Rocket Lab confirms D2C ambitions
3. Turkey establishes satellite production ecosystem
4. Italy joins Germany in IRIS2 alternate thoughts
5. Kazakhstan to create museum at Yuri Gagarin launch site
6. AST SpaceMobile gets $42 or $1500 price target
7. Analyst: GEO bloodbath taking place
8. SES AGM results: Appaloosa still objecting
9. SpaceX’s Shotwell worth $1.2bn

Categories: Press Releases

Tags: 3D, Adeia, Hybrid