EnSilica, a chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has been awarded £10.38 million (€12.4m) funding over the next three years from the UK Space Agency for a development project under its Connectivity in Low Earth Orbit (C-LEO) programme. EnSilica put forward in its application a business case supported by letters of […]

EnSilica, an ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals. The contract has been awarded through the European Space Agency’s (ESA) Advanced Research in Telecommunications Systems Core Competitiveness programme, through the support of the UK Space […]